New Thick Film Functional Devices

New Wire Bondable Gold Thick Film Conductors For LTCC Applications

Low temperature co-fired ceramic (LTCC) with silver and gold conductor systems offer a low cost, high performance, and high reliability solution utilizing the advantages of ceramic technology. Gold conductors are generally used in applications requiring best reliability in harsh environmental conditions. Gold conductors are bonded to active or passive components through wirebonding, soldering, ...

Thick Film Ni-Ferrite Inductors

Thick-film Piezoceramic Micro-generators

A sensor node is generally small in physical size (typically a few cm or smaller) and consist of a sensor, a transceiver, and supporting electronics. They are connected as a wireless network and are sometimes isolated and embedded in structures, which are not easily accessible. The lifespan of the sensor node is critically dependent upon the power source it contains. Instead of using a limited ...

A study of powder size combinations for improving piezoelectric properties of PZT thick-film devices

This paper details investigations into the effects of different powder size ratios on the d33 coefficient of thick-film PZT layers. The two powders used were 5H type PZT supplied by Morgan Electro Ceramics Ltd. These were prepared using ball milling for the large particles, ~2um, and attritor milling for the small particles, ~1um. These powders were mixed with 10% by weight of Ferro CF7575 lead...

Merging of Thin- and Thick-Film Fabrication Technologies: Toward Soft Stretchable “Island–Bridge” Devices

DOI: 10.1002/admt.201600284 fabrication of such materials onto deterministically stretchable designs thus requires reliance on other fabrication techniques. The key focus of the present work was to develop a strategy for combining lithography (thin-film) and screen-printing (thick-film) techniques to realize deterministic, high-performance stretchable devices. Screen printing has been widely us...